Digital Twin-Based Multiscale/Multistacked  3D Heterogeneous Integration Future Wireless Systems

Markondeya (Raj) Pulugurtha, John Volakis, Satheesh Bojja Venkatakrishnan & Constantinos Zekios

Florida International University

Topic 1.1.1: Using Digital Twins to Optimize Core Semiconductor Manufacturing Processes
A Digital-Twin Framework for Real-Time Device Diagnosis and Simultaneous Improvement of Manufacturing Efficiency

Topic 1.1.2: Digital Twins for Advanced Packaging and System Technology Co-Optimization Available Closed Loop Multiphysics Toolsets with Digital-Twin & AI for Adaptive In-Line Manufacturing  and Reliability

Topic 1.1.2: Digital Twins for Advanced Packaging and System Technology Co-Optimization
Our Digital Twin for Complete Transceivers

Topic 1.1.3: Digital Twin Validation Across Semiconductor and/or Packaging Technologies:
SMART Adaptive Manufacturing with In-Line Monitoring

Topic 1.2.1/1.2.2 Education and Workforce Development-Increased Access to Community Colleges and other Workforce and Community Programs

Develop a diverse, interdisciplinary, and globally competitive workforce to sustain U.S. leadership in electronics R&D and manufacturing.

Planned Activities:

• Integrated Education Model – Cross-disciplinary training in AI/ML, materials chemistry, mechatronics, hardware integration, and telecommunications.
• University-Industry Collaboration – Joint programs with FIU, other partner universities, Electronics Manufacturing Companies, SRC, MDC, and FMU to enhance hands-on learning.
• Training and Internships – Industry-funded workshops, capstone projects, and internships with over 20 industry partners.
• STEM Engagement & Outreach

K-12 Teacher-Researchers program to train educators in cutting-edge technology.

Summer camps & mentorship programs for high school & undergraduate students.

Enhanced pathways from research to manufacturing

Miami Dade College (MDC):

• One of the largest community colleges in the U.S. with ~100,000 students
• Serves a population of 6.1 million in Greater Miami
• Strategic partner for recruiting minority students into electronics manufacturing, wireless and emerging technology sectors
• Supports both regional and national workforce and economic development

EXTRAS

Topic 1.1.1: Using Digital Twins to Optimize Core Semiconductor Manufacturing Processes
Smart Adaptable Manufacturing for 10-100X Cost Reduction in Electronics Production

Topic 1.1.2: Digital Twins for Advanced Packaging and System Technology Co-Optimization
FIU Provides a Simplified Versatile Manufacturing Approach and Infrastructure for Electronics

Topic 1.1.2: Digital Twins for Advanced Packaging and System Technology Co-Optimization
Mitigating Model-Based Simulations via Digital Twin Analysis

Topic 1.1.2: Digital Twins for Advanced Packaging and System Technology Co-Optimization Example Design 1: Adaptive Assembly, Pad Access and Trace Patterning for 5G/6G

Topic 1.1.2: Digital Twins for Advanced Packaging and System Technology Co-Optimization Example Design 2: UWB and Reconfigurable Apertures with Advanced  3D Packaging

Topic 1.1.2: Digital Twins for Advanced Packaging and System Technology Co-Optimization Example Design 3: Power and Data Transfer Tiles Between Sensors and AI Hubs

Topic 1.1.3: Digital Twin Validation Across Semiconductor and/or Packaging Technologies
Available Closed Loop Multiphysics Toolsets with Digital-Twin & AI for Adaptive In-Line Manufacturing  and Reliability

Topic 1.2.2: Education and Workforce Development-Establishing a Library of New and Pre-Existing Content And Educational Training Programs

Cybermanufacturing & Assembly Training

• New course on chiplet-based cybermanufacturing at FIU covering:
• Semiconductor packaging & assembly
• Electrical & mechanical reliability
• Interdisciplinary integration (ECE, ME, MSE, AI/ML)
• Hands-on lab experience with other partner universities on robot-assisted chiplet embedding and virtual lab support.

CRF System Integration & Design

Curriculum in RFIC, THz, MIMO, EMI/EMC, Heterogeneous Integration

Objectives

• Bridge gaps between system integration, circuit design, and communication layers.
• Develop industry-aligned learning pathways.
• Create real-world research experiences and mentorship programs.

Industry Partnerships & Capstone Projects

• Annual university-industry workshops with Electronics Manufacturing Companies & SRC.
• Students develop a functional technology prototype using advanced manufacturing tools.
• Graduates equipped with industry-relevant skills in RF systems, microelectronics, and packaging technologies.